APA ציטוט

Leong, H. S. Developing molding technology module - study on effects of process parameter and equipment on mold defects for ball grid array (BGA) package.

Chicago Style (17th ed.) Citation

Leong, Hooi Shea. Developing Molding Technology Module - Study on Effects of Process Parameter and Equipment on Mold Defects for Ball Grid Array (BGA) Package.

ציטוט MLA

Leong, Hooi Shea. Developing Molding Technology Module - Study on Effects of Process Parameter and Equipment on Mold Defects for Ball Grid Array (BGA) Package.