Developing molding technology module - study on effects of process parameter and equipment on mold defects for ball grid array (BGA) package

Developing molding technology module - study on effects of process parameter and equipment on mold defects for ball grid array (BGA) package

The aim of this project is to assert an optimize process parameter for a robust CGM transfer molding process in Ultra Fine Pitch (UFP) package. Project final result is a solution for encapsulating 35 micron wire bonded PBGA.

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Dades bibliogràfiques
Autor principal:	Leong, Hooi Shea (Autor)
Format:	Electrònic Software Base de dades
Idioma:	English
Matèries:	Matellurgy.
Etiquetes:	Afegir etiqueta Sense etiquetes, Sigues el primer a etiquetar aquest registre!

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