Developing molding technology module - study on effects of process parameter and equipment on mold defects for ball grid array (BGA) package

Developing molding technology module - study on effects of process parameter and equipment on mold defects for ball grid array (BGA) package

The aim of this project is to assert an optimize process parameter for a robust CGM transfer molding process in Ultra Fine Pitch (UFP) package. Project final result is a solution for encapsulating 35 micron wire bonded PBGA.

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Bibliografiske detaljer
Hovedforfatter:	Leong, Hooi Shea (Author)
Format:	Electronisk Software Database
Sprog:	English
Fag:	Matellurgy.
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Lignende værker

Characterization of corroded anodized coating on titanium, austenitic steel and aluminium base alloy commercially used
af: Lee, Chee Hong

Lattice imperfections in intermetallic ti-al alloys: an x-ray diffraction study of the microstructure by the rietveld method
af: Lee, Liu Mei

Developing a mold technology module for freescale - study on effects of materials (compound properties) and molding process parameters on package moldability for QFP
af: Tan, Hui Khin

Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA)
af: Muhammad Nubli Bin Zulkifli
Udgivet: (2008)

Injection molding in packaging /
af: Mohamad Faisol Hashim
Udgivet: (1997)

Mold filling parameters in resin transfer molding for flip chip semiconductor packages
af: Lim, Ming Siong
Udgivet: (2017)

Mold filling parameters in resin transfer molding for flip chip semiconductor packages
af: Lim, Ming Siong
Udgivet: (2017)

Ball grid array technolog : edited by John H Lau.
Udgivet: (1995)

Characterization on the effect of electrospinning parameters on polyacrylonitrile (Pan)/
af: Nurul Azni Binti Bakaruddin
Udgivet: (2016)

Effect of Ball to Powder Ratio and Media Density on Fine Grinding and Mechanical Activation of Hematite Ores in Planetary Mill /
af: Siti Izatul Hawa Khairol Salleh
Udgivet: (2017)

Injection molds and molding : a practical manual /
af: Dym, Joseph B.
Udgivet: (1987)

Study of parameters settings that effect on sink marks defect in plastic injection molding process of stationery holder mold /
af: Mohamad Azrim Zulkifli
Udgivet: (2016)

Study of parameters settings that effect on sink marks defect in plastic injection molding process of stationery holder mold /
af: Mohamad Azrim Zulkifli
Udgivet: (2016)

Effect of Mixing Parameter on Epoxy Composites: Mechanical and Microscopy Analysis /
af: Ng, Soo Li
Udgivet: (2017)

Controlling the synthesis parameter during fe(OH)2 precipitation for goethite formation /
af: Noraishah Binti Mohamed Noor
Udgivet: (2016)

Study the parameter optimization in the injection molding
af: Suhaila Yacob
Udgivet: (2007)

Study the parameter optimization in the injection molding
af: Suhaila Yacob
Udgivet: (2007)

Defect in injection molding of computer fan blade /
af: Muhamad Hafizie Rosli
Udgivet: (2017)

Defect in injection molding of computer fan blade /
af: Muhamad Hafizie Rosli
Udgivet: (2017)

Optimization of resistance spot welding process parameters on galvanised steel by using Taguchi method/
af: Jaraman, Poorani
Udgivet: (2017)

Optimisation of anodising parameter with oxalic acid for the formation of anodic aluminium oxide by using taguchi methods /
af: Nor Syammimi Binti Abu Hasan
Udgivet: (2016)

An investigation into mold design for injection molding /
af: Rosdan Mamat
Udgivet: (1996)

The influence of welding parameters and corrosive environment on the joint strength of resistance spot-welded mild steel sheets
af: Ahmad Azid Tahar Ahmad Latiffi

Study on the effect of reinforcement particle size parameter on aluminum metal matrix composite reinforced with alumina particles
af: Salihah Tan Shilan

The effect of injection process parameters on product defect during injection molding process /
af: Mohd Zain Abdul Jais
Udgivet: (2012)

The effect of injection process parameters on product defect during injection molding process /
af: Mohd Zain Abdul Jais
Udgivet: (2012)

Effects of ultrasonication-assisted homogenization on morphology and properties of Thermoplastic Starch/Cellulose Biocomposites /
af: Tan, Leong Ping
Udgivet: (2017)

Area array packaging processes : for BGA, flip chip and CSP /
Udgivet: (2004)

Area array packaging processes : for BGA, Flip Chip, and CSP /

Injection molds .

Compression molding /
Udgivet: (2003)

Mold engineering /
af: Rees, Herbert
Udgivet: (2002)

Liquid molding .
Udgivet: (2005)

Compression molding .
Udgivet: (2005)

Mold engineering
af: Rees, Herbert
Udgivet: (2002)

Mold engineering /
af: Rees, Herbert
Udgivet: (2002)

Molding techniques /
af: Chavarria, Joaquim

Mold engineering
af: Rees, Herbert
Udgivet: (2002)

Mold engineering /
af: Rees, Herbert
Udgivet: (2002)

Mold awareness .
Udgivet: (2003)