Developing molding technology module - study on effects of process parameter and equipment on mold defects for ball grid array (BGA) package
The aim of this project is to assert an optimize process parameter for a robust CGM transfer molding process in Ultra Fine Pitch (UFP) package. Project final result is a solution for encapsulating 35 micron wire bonded PBGA.
Sábháilte in:
Príomhchruthaitheoir: | Leong, Hooi Shea (Údar) |
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Formáid: | Leictreonach Bogearraí Bunachar sonraí |
Teanga: | English |
Ábhair: | |
Clibeanna: |
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Míreanna comhchosúla
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Characterization of corroded anodized coating on titanium, austenitic steel and aluminium base alloy commercially used
de réir: Lee, Chee Hong -
Lattice imperfections in intermetallic ti-al alloys: an x-ray diffraction study of the microstructure by the rietveld method
de réir: Lee, Liu Mei -
Developing a mold technology module for freescale - study on effects of materials (compound properties) and molding process parameters on package moldability for QFP
de réir: Tan, Hui Khin -
Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA)
de réir: Muhammad Nubli Bin Zulkifli
Foilsithe / Cruthaithe: (2008) -
Injection molding in packaging /
de réir: Mohamad Faisol Hashim
Foilsithe / Cruthaithe: (1997)