Developing molding technology module - study on effects of process parameter and equipment on mold defects for ball grid array (BGA) package

Developing molding technology module - study on effects of process parameter and equipment on mold defects for ball grid array (BGA) package

The aim of this project is to assert an optimize process parameter for a robust CGM transfer molding process in Ultra Fine Pitch (UFP) package. Project final result is a solution for encapsulating 35 micron wire bonded PBGA.

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書誌詳細
第一著者:	Leong, Hooi Shea (著者)
フォーマット:	電子媒体ソフトウェアデータベース
言語:	English
主題:	Matellurgy.
タグ:	タグ追加タグなし, このレコードへの初めてのタグを付けませんか!

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