Developing molding technology module - study on effects of process parameter and equipment on mold defects for ball grid array (BGA) package
The aim of this project is to assert an optimize process parameter for a robust CGM transfer molding process in Ultra Fine Pitch (UFP) package. Project final result is a solution for encapsulating 35 micron wire bonded PBGA.
Na minha lista:
| Autor principal: | |
|---|---|
| Formato: | Recurso Eletrônico Software Base de Dados |
| Idioma: | English |
| Assuntos: | |
| Tags: |
Adicionar Tag
Sem tags, seja o primeiro a adicionar uma tag!
|