Developing molding technology module - study on effects of process parameter and equipment on mold defects for ball grid array (BGA) package
The aim of this project is to assert an optimize process parameter for a robust CGM transfer molding process in Ultra Fine Pitch (UFP) package. Project final result is a solution for encapsulating 35 micron wire bonded PBGA.
Sábháilte in:
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| Formáid: | Leictreonach Bogearraí Bunachar sonraí |
| Teanga: | English |
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| Clibeanna: |
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