Developing molding technology module - study on effects of process parameter and equipment on mold defects for ball grid array (BGA) package

The aim of this project is to assert an optimize process parameter for a robust CGM transfer molding process in Ultra Fine Pitch (UFP) package. Project final result is a solution for encapsulating 35 micron wire bonded PBGA.

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Bibliographic Details
Main Author: Leong, Hooi Shea (Author)
Format: Electronic Software Database
Language:English
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