Aging effect of sn-ag-cu lead free solder
This project is based on the aging effects on the creep behavior of Sn-Ag-Cu lead free solders. 2 types of alloy were studied which Sn-Ag-Cu eutectic and Sn-Pb eutectic alloy. Aging studies of SAC solder alloy have been performed in order to evaluate microstructure changes especially focusing on the...
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| Médium: | Elektronický zdroj Program Databáze |
| Jazyk: | English |
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| Shrnutí: | This project is based on the aging effects on the creep behavior of Sn-Ag-Cu lead free solders. 2 types of alloy were studied which Sn-Ag-Cu eutectic and Sn-Pb eutectic alloy. Aging studies of SAC solder alloy have been performed in order to evaluate microstructure changes especially focusing on the growth kinetics of the IMC layers that formed between the different solder alloys and substrates. For this final project, the main objectives are to study the aging heat treatment for lead free solder and to study the microstructure after the aging treatment |
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| Popis jednotky: | Final Year Project |
| Fyzický popis: | 1 CD-ROM 4 3/4 in. |