Aging effect of sn-ag-cu lead free solder
This project is based on the aging effects on the creep behavior of Sn-Ag-Cu lead free solders. 2 types of alloy were studied which Sn-Ag-Cu eutectic and Sn-Pb eutectic alloy. Aging studies of SAC solder alloy have been performed in order to evaluate microstructure changes especially focusing on the...
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| Format: | Elektronski Software Database |
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| LEADER | 01520nmi a2200241 a 4500 | ||
|---|---|---|---|
| 001 | vtls000053043 | ||
| 003 | MY-KaKUK | ||
| 005 | 20210816100217.0 | ||
| 007 | co bg a | ||
| 008 | 111129s2008 my f d 000 0 eng d | ||
| 039 | 9 | |a 201111291650 |b VLOAD |c 201005051213 |d SMT |c 200909171057 |d RAR |y 200905130936 |z SNSA | |
| 090 | 0 | 0 | |a TN665 |b B2J23 2008 |
| 100 | 0 | |a Mohd Jaffry Radzi |e author | |
| 245 | 1 | 0 | |a Aging effect of sn-ag-cu lead free solder |h [electronic resource] / |c Mohd Jaffry Radzi. |
| 264 | 0 | |a Perlis, Malaysia |b School of Materials Engineering, Universiti Malaysia Perlis |c 2008. | |
| 300 | |a 1 CD-ROM |c 4 3/4 in. | ||
| 500 | |a Final Year Project | ||
| 520 | 2 | |a This project is based on the aging effects on the creep behavior of Sn-Ag-Cu lead free solders. 2 types of alloy were studied which Sn-Ag-Cu eutectic and Sn-Pb eutectic alloy. Aging studies of SAC solder alloy have been performed in order to evaluate microstructure changes especially focusing on the growth kinetics of the IMC layers that formed between the different solder alloys and substrates. For this final project, the main objectives are to study the aging heat treatment for lead free solder and to study the microstructure after the aging treatment | |
| 650 | 0 | |a Metallurgy. | |
| 949 | |a VIRTUAITEM |d 30000 |f 1 |x 701 |6 902000303 |a TN665 B2J23 2008 | ||
| 942 | |2 lcc |c COMPFILE | ||
| 999 | |c 92280 |d 92280 | ||
| 952 | |0 0 |1 0 |2 lcc |4 0 |6 TN0665 B2 J23 02008 |7 0 |9 89806 |a PTSFP |b PTSFP |c 8 |d 2021-08-16 |l 0 |o TN665 B2J23 2008 |p 902000303 |r 2021-08-16 |t 1 |w 2021-08-16 |y COMPFILE | ||