Aging effect of sn-ag-cu lead free solder
This project is based on the aging effects on the creep behavior of Sn-Ag-Cu lead free solders. 2 types of alloy were studied which Sn-Ag-Cu eutectic and Sn-Pb eutectic alloy. Aging studies of SAC solder alloy have been performed in order to evaluate microstructure changes especially focusing on the...
में बचाया:
मुख्य लेखक: | Mohd Jaffry Radzi (लेखक) |
---|---|
स्वरूप: | इलेक्ट्रोनिक सॉफ्टवेयर डेटाबेस |
भाषा: | English |
विषय: | |
टैग : |
टैग जोड़ें
कोई टैग नहीं, इस रिकॉर्ड को टैग करने वाले पहले व्यक्ति बनें!
|
समान संसाधन
-
Effect of Zinc Additions on SN-0.7CU-0.05NI Lead Free Solder Alloy /
द्वारा: Nurul Ashikin Saleh
प्रकाशित: (2017) -
Effect of corrosion in acidic solution to the phase and microstructure of sn-cu solder/
द्वारा: Gan, Zhi Wan
प्रकाशित: (2016) -
Effect of polarization scan rate on corrosion in acidic solution to the properties of Sn-Cu solder/
द्वारा: Low, Suk Yen
प्रकाशित: (2016) -
Synthesis and Characterization of Lead Free SnCu & SnCu/SiC composite solder paste /
द्वारा: Nur Syahirah Mohamad Zaimi
प्रकाशित: (2017) -
Effect of current stressing on intermetallic formation and mechanical properties of lead free sac solder and sac/activated carbon composite solder joint/
द्वारा: Syahirah Alyaa Yahya
प्रकाशित: (2016)