Aging effect of sn-ag-cu lead free solder

Aging effect of sn-ag-cu lead free solder

This project is based on the aging effects on the creep behavior of Sn-Ag-Cu lead free solders. 2 types of alloy were studied which Sn-Ag-Cu eutectic and Sn-Pb eutectic alloy. Aging studies of SAC solder alloy have been performed in order to evaluate microstructure changes especially focusing on the...

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Bibliografski detalji
Glavni autor:	Mohd Jaffry Radzi (Autor)
Format:	Elektronički Softver Baza podataka
Jezik:	English
Teme:	Metallurgy.
Oznake:	Dodaj oznaku Bez oznaka, Budi prvi tko označuje ovaj zapis!

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