Aging effect of sn-ag-cu lead free solder
This project is based on the aging effects on the creep behavior of Sn-Ag-Cu lead free solders. 2 types of alloy were studied which Sn-Ag-Cu eutectic and Sn-Pb eutectic alloy. Aging studies of SAC solder alloy have been performed in order to evaluate microstructure changes especially focusing on the...
Bewaard in:
Hoofdauteur: | Mohd Jaffry Radzi (Auteur) |
---|---|
Formaat: | Elektronisch Software Databank |
Taal: | English |
Onderwerpen: | |
Tags: |
Voeg label toe
Geen labels, Wees de eerste die dit record labelt!
|
Gelijkaardige items
-
Effect of Zinc Additions on SN-0.7CU-0.05NI Lead Free Solder Alloy /
door: Nurul Ashikin Saleh
Gepubliceerd in: (2017) -
Effect of corrosion in acidic solution to the phase and microstructure of sn-cu solder/
door: Gan, Zhi Wan
Gepubliceerd in: (2016) -
Effect of polarization scan rate on corrosion in acidic solution to the properties of Sn-Cu solder/
door: Low, Suk Yen
Gepubliceerd in: (2016) -
Synthesis and Characterization of Lead Free SnCu & SnCu/SiC composite solder paste /
door: Nur Syahirah Mohamad Zaimi
Gepubliceerd in: (2017) -
Effect of current stressing on intermetallic formation and mechanical properties of lead free sac solder and sac/activated carbon composite solder joint/
door: Syahirah Alyaa Yahya
Gepubliceerd in: (2016)