Aging effect of sn-ag-cu lead free solder

Aging effect of sn-ag-cu lead free solder

This project is based on the aging effects on the creep behavior of Sn-Ag-Cu lead free solders. 2 types of alloy were studied which Sn-Ag-Cu eutectic and Sn-Pb eutectic alloy. Aging studies of SAC solder alloy have been performed in order to evaluate microstructure changes especially focusing on the...

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Bibliografske podrobnosti
Glavni avtor:	Mohd Jaffry Radzi (Author)
Format:	Elektronski Software Database
Jezik:	English
Teme:	Metallurgy.
Oznake:	Označite Brez oznak, prvi označite!

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