Aging effect of sn-ag-cu lead free solder
This project is based on the aging effects on the creep behavior of Sn-Ag-Cu lead free solders. 2 types of alloy were studied which Sn-Ag-Cu eutectic and Sn-Pb eutectic alloy. Aging studies of SAC solder alloy have been performed in order to evaluate microstructure changes especially focusing on the...
Shranjeno v:
| Glavni avtor: | |
|---|---|
| Format: | Elektronski Software Database |
| Jezik: | English |
| Teme: | |
| Oznake: |
Označite
Brez oznak, prvi označite!
|
Vzdrževanje sistema
Trenutno vzdržujemo knjižnični informacijski sistem.
Informacije o zalogi so trenutno nedostopne. Opravičujemo se za nevšečnosti in vas prosimo da nas ponovno kontaktirate: