Characterization of intermetallic growth in gold ballbonds on aluminum metallization [electronic resource] /
This final year project is to study the capability of gold wire bonding process by investigating the intermetallic growth between gold ball bonds and aluminum bond pad.
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| Materyal Türü: | Yazılım Veritabanı |
| Dil: | English |
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| LEADER | 01203nmi a2200241 a 4500 | ||
|---|---|---|---|
| 001 | vtls000050989 | ||
| 003 | MY-KaKUK | ||
| 005 | 20210816100227.0 | ||
| 007 | co bg llla a | ||
| 008 | 111129s2007 my f d 000 0 eng d | ||
| 039 | 9 | |a 201111291710 |b VLOAD |c 201111161330 |d VLOAD |c 200909171207 |d SMT |c 200904161120 |d RAR |y 200903231657 |z SNSA | |
| 090 | 0 | 0 | |a TK7874 |b M7L732 2007 |
| 100 | 0 | |a Lim, Moy Fung. |e author | |
| 245 | 1 | 0 | |a Characterization of intermetallic growth in gold ballbonds on aluminum metallization [electronic resource] / |c Lim Moy Fung |
| 264 | 0 | |a Perlis, Malaysia |b School of Microelectronic Engineering, Universiti Malaysia Perlis |c 2007. | |
| 300 | |a 1 CD-ROM |c 4 3/4 in. | ||
| 500 | |a Final Year Project | ||
| 520 | |a This final year project is to study the capability of gold wire bonding process by investigating the intermetallic growth between gold ball bonds and aluminum bond pad. | ||
| 650 | 0 | |a Microelectronics. | |
| 949 | |a VIRTUAITEM |d 30000 |f 1 |x 701 |6 902000021 |a TK7874 M7L732 2007 | ||
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