Characterization of intermetallic growth in gold ballbonds on aluminum metallization [electronic resource] /
This final year project is to study the capability of gold wire bonding process by investigating the intermetallic growth between gold ball bonds and aluminum bond pad.
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| Main Author: | Lim, Moy Fung (Author) |
|---|---|
| Format: | Software Database |
| Language: | English |
| Subjects: | |
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