Study of the thickness of the silicon dioxide on wafer using dry and wet oxidation method
This final year project focused on four goals: to study the dry and wet oxidation thickness, to grow a thin layer of silicon dioxide (SiO2) on Si wafer, to determine the parameter required for thickness needed, and to compare with the simulation and theoretical thickness to achieve the most accurate...
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| LEADER | 01389nmi a2200241 a 4500 | ||
|---|---|---|---|
| 001 | vtls000051315 | ||
| 003 | MY-KaKUK | ||
| 005 | 20210816100340.0 | ||
| 007 | co bg llla a | ||
| 008 | 111129s2008 my f d eng d | ||
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| 090 | 0 | 0 | |a TK7874 |b M7F146 2008 |
| 100 | 0 | |a Mohamad Fadzli Ali. |e author | |
| 245 | 1 | 0 | |a Study of the thickness of the silicon dioxide on wafer using dry and wet oxidation method |h [electronic resource] / |c Mohamad Fadzli Ali. |
| 264 | 0 | |a Kangar, Perlis |b School of Microelectronic Engineering, Universiti Malaysia Perlis |c 2008. | |
| 300 | |a 1 CD-ROM |c 4 3/4 in. | ||
| 500 | |a Final Year Project | ||
| 520 | |a This final year project focused on four goals: to study the dry and wet oxidation thickness, to grow a thin layer of silicon dioxide (SiO2) on Si wafer, to determine the parameter required for thickness needed, and to compare with the simulation and theoretical thickness to achieve the most accurate parameter for the thickness required. | ||
| 650 | 0 | |a Microelectronics. | |
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| 942 | |2 lcc |c COMPFILE | ||
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