Study of the effect of different gases parameter in dry etching process on etch rate profile
The principal focus of this project is dry etching technique by using the Inductively Couple Plasma -Reactive Ion Etching (ICP-RIE). This final year project is about to understand and control the equipment for dry etches process. The equipment in dry etch process is inductively couple plasma- reacti...
Sábháilte in:
| Príomhchruthaitheoir: | |
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| Formáid: | Leictreonach Bogearraí Bunachar sonraí |
| Teanga: | English |
| Ábhair: | |
| Clibeanna: |
Cuir clib leis
Níl clibeanna ann, Bí ar an gcéad duine le clib a chur leis an taifead seo!
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| Achoimre: | The principal focus of this project is dry etching technique by using the Inductively Couple Plasma -Reactive Ion Etching (ICP-RIE). This final year project is about to understand and control the equipment for dry etches process. The equipment in dry etch process is inductively couple plasma- reactive ion etching (ICP-RIE). |
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| Cur síos ar an mír: | Final Year Project |
| Cur síos fisiciúil: | 1 CD-ROM 4 3/4 in. |