Study of the effect of different gases parameter in dry etching process on etch rate profile

The principal focus of this project is dry etching technique by using the Inductively Couple Plasma -Reactive Ion Etching (ICP-RIE). This final year project is about to understand and control the equipment for dry etches process. The equipment in dry etch process is inductively couple plasma- reacti...

Cur síos iomlán

Sábháilte in:

Sonraí bibleagrafaíochta
Príomhchruthaitheoir:	Zaharah Mohamad (Údar)
Formáid:	Leictreonach Bogearraí Bunachar sonraí
Teanga:	English
Ábhair:	Microelectronics.
Clibeanna:	Cuir clib leis Níl clibeanna ann, Bí ar an gcéad duine le clib a chur leis an taifead seo!

Míreanna comhchosúla

Reactive ion etching (RIE) etched wet-silica-on-silicon analysis for fluidwettability
de réir: Noor Aini Hamimah Abd. Rahim

Study of aspect ratio performance on silicon oxide etching using profiler meter, AFM and SEM
de réir: Nur Syuhada Md. Desa

Comparison of etching optimization process by taguchi method using minitab and design expert software
de réir: Azleen Abu Talib

Dry Etching Technology for Semiconductors /
de réir: Nojiri, Kazuo
Foilsithe / Cruthaithe: (2015)

Design and fabricate "wineglass" contact formation by simultaneous wet-dry etch process.
de réir: Mohd Norhafiz Bin. Hashim

Polysilicon process development - the effect of pecvd process parameters on the film characteristics
de réir: Mujahidun Mashuri

The study of the effect of MOS transistor scaling on the critical device parameters
de réir: Zazurina Abd Rahman

Study of the thickness of the silicon dioxide on wafer using dry and wet oxidation method
de réir: Mohamad Fadzli Ali

The effect of process parameters on metal step coverage for aluminum (AI) by evaporation technique
de réir: Noraishah Azman

Ultra violet scanner, PCB developer and etching machine
de réir: Nur Bazilah Mohd Suhaimi
Foilsithe / Cruthaithe: (2010)

Ultra violet scanner, PCB developer and etching machine
de réir: Nur Bazilah Mohd Suhaimi
Foilsithe / Cruthaithe: (2010)

Effect of different dielectric materials for ultrathin oxide
de réir: Zarimawaty Zailan

Portable etching machine/
de réir: Julasri Ragiman
Foilsithe / Cruthaithe: (2018)

Etching & microscopy 09
Foilsithe / Cruthaithe: (2009)

Portable etching machine /
de réir: Muhammad Azlan Shah Ibrahim
Foilsithe / Cruthaithe: (2015)

Etching & microscopy 09
Foilsithe / Cruthaithe: (2009)

Portable etching machine /
de réir: Muhammad Azlan Shah Ibrahim
Foilsithe / Cruthaithe: (2015)

Study the effect of bird's beak on fully recessed locos and poly buffered locos using 2 different pad oxide
de réir: Hafizal Hafiz Sarjoni

Theoretical study, simulation & fabrication on dry oxidation in terms of Si02 layer thinckness, resistivity & surface roughness
de réir: Mohd Adam Alias

Simulation on effect of different types of channel/ drain engineering structure on MOS device performance
de réir: Norazlina Mohd Amin

Level 1 parameter extraction of MOSFET device
de réir: Azman mat Hussin

Study of the temperature effect on thickness and surface roughness of Si02
de réir: Mohd Azdi Asis

Study the effect of environmental noise on infrared Tx-Rx circuit signals
de réir: Mohd Zaihan Ibrahim

Simulation on parameter and characteristics extraction between two simulation packages (synopsys and pspice)
de réir: Nor Aznin Sakrani

Nanostructure formation using sem based e-beam lithography (EBL) technique : buffered oxide etch (BOE) profile
de réir: Nur Nazihah Halemi

The study on the effect of varing dopant concentration and diffusion time in the design of silicon avalanche diode with minimum VBR of 120+-20%
de réir: Yip, Siew Ling

Study of semi-recessed LOCOS for quasi-nanoscale CMOS devise isolation
de réir: Mohamad Idzham Abd Sani

Study of deposition time influence the conical structure during electron beam induced deposition (EBID)
de réir: Mohamad Shahrizal Md Ilias

Study and design infrared beacon for the blind
de réir: Mohd Fadzlie Rasit

Thin polycrystalline silicon process development
de réir: Muniyati Pakhuruddin

Study and improvement of UniMAP shower room
de réir: Lau, Iyu Pin

The effect of power density on the surface layer of amorphous thin film
de réir: Ahmad Fadzil Izaharuddin

Effect of diffusion coefficient and junction depth on variation of temperature and energy
de réir: Nur Ruzana Bohari

Optimization of nitride deposition process using Taguchi method
de réir: Low, Zen Shiang

Semiconductor optical amplifier (SOA) for photonic signal processing/
de réir: Latty Shazana Ismail
Foilsithe / Cruthaithe: (2011)

Area array packaging processes : for BGA, flip chip and CSP /
Foilsithe / Cruthaithe: (2004)

Area array packaging processes : for BGA, Flip Chip, and CSP /

Study the basic infrared tx-rx circuit design for robot
de réir: Nik Ahmad Faiz Abdul Jamel

Fabrication of 50 ¡Łm transistor and AINiAu interconnection process
de réir: Shaffie Husin

Optimization on oxidation process using 2K factorial design method
de réir: Yeap, Li Chain