Study of the effect of different gases parameter in dry etching process on etch rate profile

The principal focus of this project is dry etching technique by using the Inductively Couple Plasma -Reactive Ion Etching (ICP-RIE). This final year project is about to understand and control the equipment for dry etches process. The equipment in dry etch process is inductively couple plasma- reacti...

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Bibliografske podrobnosti
Glavni avtor:	Zaharah Mohamad (Author)
Format:	Elektronski Software Database
Jezik:	English
Teme:	Microelectronics.
Oznake:	Označite Brez oznak, prvi označite!

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