Study of the effect of different gases parameter in dry etching process on etch rate profile
The principal focus of this project is dry etching technique by using the Inductively Couple Plasma -Reactive Ion Etching (ICP-RIE). This final year project is about to understand and control the equipment for dry etches process. The equipment in dry etch process is inductively couple plasma- reacti...
Saved in:
| 主要作者: | |
|---|---|
| 格式: | 电子 软件 数据库 |
| 语言: | English |
| 主题: | |
| 标签: |
添加标签
没有标签, 成为第一个标记此记录!
|
System Under Maintenance
Our Library Management System is currently under maintenance.
Holdings and item availability information is currently unavailable. Please accept our apologies for any inconvenience this may cause and contact us for further assistance: