Effect of current stressing on intermetallic formation and mechanical properties of lead free sac solder and sac/activated carbon composite solder joint/
This study will investigate the effects of current stressing on intermetallic compound growth and the mechanical properties of lead free SAC and SAC/Activated carbon solder composite solder joint for certain current stressing time.. Soldered wires will be set up on the power supply with current 0.20...
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| 第一著者: | |
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| フォーマット: | 学位論文 ソフトウェア eBook |
| 言語: | English |
| 出版事項: |
Perlis, Malaysia
School of Materials Engineering, University Malaysia Perlis
2016
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| 主題: | |
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| 要約: | This study will investigate the effects of current stressing on intermetallic compound growth and the mechanical properties of lead free SAC and SAC/Activated carbon solder composite solder joint for certain current stressing time.. Soldered wires will be set up on the power supply with current 0.20 A and left for 2 weeks. The current stressing observed at 24 hours, 240 hours and 360 hours. The results should indicate that the IMC layers under high current stressing increasing due to the joule heat produced by the current stressing. The IMC layer of SAC solder and SAC/Activated carbon composite solder joint will be observed under Scanning Electron Microscope and Optical Microscope (OM). While, the elemental analysis for the atom in the appeared phases will be examined under Dipersive X-ray(EDX). Next, the result of tensile test should show an improvement in the tensile strength of SAC solder and SAC/Activated carbon for mechanical properties. |
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| 物理的記述: | 1 CD-ROM 12 cm. |