Effect of current stressing on intermetallic formation and mechanical properties of lead free sac solder and sac/activated carbon composite solder joint/
This study will investigate the effects of current stressing on intermetallic compound growth and the mechanical properties of lead free SAC and SAC/Activated carbon solder composite solder joint for certain current stressing time.. Soldered wires will be set up on the power supply with current 0.20...
Guardat en:
Autor principal: | Syahirah Alyaa Yahya (Autor) |
---|---|
Format: | Thesis Software eBook |
Idioma: | English |
Publicat: |
Perlis, Malaysia
School of Materials Engineering, University Malaysia Perlis
2016
|
Matèries: | |
Etiquetes: |
Afegir etiqueta
Sense etiquetes, Sigues el primer a etiquetar aquest registre!
|
Ítems similars
-
The Effect of Thermal Aging on Intermetallic Compound Growth of SAC/Activated Carbon(AC) Composite Solder /
per: Norhafifah Binti Zainal Azlin
Publicat: (2016) -
Effect of corrosion in acidic solution to the phase and microstructure of sac305 solder /
per: Khoo, Cheng Hao
Publicat: (2016) -
Aging effect of sn-ag-cu lead free solder
per: Mohd Jaffry Radzi -
The effect of multiple reflow soldering for SAC305 and SAC405 on lead-free solder /
per: Noraini Abdul Kadir
Publicat: (2015) -
Effect of Zinc Additions on SN-0.7CU-0.05NI Lead Free Solder Alloy /
per: Nurul Ashikin Saleh
Publicat: (2017)