Effect of current stressing on intermetallic formation and mechanical properties of lead free sac solder and sac/activated carbon composite solder joint/
This study will investigate the effects of current stressing on intermetallic compound growth and the mechanical properties of lead free SAC and SAC/Activated carbon solder composite solder joint for certain current stressing time.. Soldered wires will be set up on the power supply with current 0.20...
Αποθηκεύτηκε σε:
Κύριος συγγραφέας: | Syahirah Alyaa Yahya (Συγγραφέας) |
---|---|
Μορφή: | Thesis Λογισμικό Ηλ. βιβλίο |
Γλώσσα: | English |
Έκδοση: |
Perlis, Malaysia
School of Materials Engineering, University Malaysia Perlis
2016
|
Θέματα: | |
Ετικέτες: |
Προσθήκη ετικέτας
Δεν υπάρχουν, Καταχωρήστε ετικέτα πρώτοι!
|
Παρόμοια τεκμήρια
-
The Effect of Thermal Aging on Intermetallic Compound Growth of SAC/Activated Carbon(AC) Composite Solder /
ανά: Norhafifah Binti Zainal Azlin
Έκδοση: (2016) -
Effect of corrosion in acidic solution to the phase and microstructure of sac305 solder /
ανά: Khoo, Cheng Hao
Έκδοση: (2016) -
Aging effect of sn-ag-cu lead free solder
ανά: Mohd Jaffry Radzi -
The effect of multiple reflow soldering for SAC305 and SAC405 on lead-free solder /
ανά: Noraini Abdul Kadir
Έκδοση: (2015) -
Effect of Zinc Additions on SN-0.7CU-0.05NI Lead Free Solder Alloy /
ανά: Nurul Ashikin Saleh
Έκδοση: (2017)