Effect of current stressing on intermetallic formation and mechanical properties of lead free sac solder and sac/activated carbon composite solder joint/
This study will investigate the effects of current stressing on intermetallic compound growth and the mechanical properties of lead free SAC and SAC/Activated carbon solder composite solder joint for certain current stressing time.. Soldered wires will be set up on the power supply with current 0.20...
Saved in:
| 主要作者: | |
|---|---|
| 格式: | Thesis 软件 电子书 |
| 语言: | English |
| 出版: |
Perlis, Malaysia
School of Materials Engineering, University Malaysia Perlis
2016
|
| 主题: | |
| 标签: |
添加标签
没有标签, 成为第一个标记此记录!
|
成为第一个发表评论!