Hybrid microcircuit technology handbook : materials, processes, design, testing, and production /
Integrates the many diverse technologies used in the design, fabrication, assembly, and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. Among these are: resistor trimming, wire bonding, die attachment, cleaning, hermetic sealing, and moisture analysis...
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| Format: | Software eBook |
| Language: | English |
| Published: |
Westwood, N.J.
Noyes Publications
1998.
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| Edition: | Second edition. |
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| Summary: | Integrates the many diverse technologies used in the design, fabrication, assembly, and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. Among these are: resistor trimming, wire bonding, die attachment, cleaning, hermetic sealing, and moisture analysis. In addition to thin films, thick films, and assembly processes, chapters on substrate selections, handling (including electrostatic discharge), failure analysis, and documentation are included. A comprehensive chapter of design guidelines is also present. |
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| Physical Description: | 1 CD-ROM 12 cm. |
| Bibliography: | Includes bibliographical references and index. |
| ISBN: | 9780815519843 (electronic bk.) 0815519842 (electronic bk.) |