Azmi Kamardin. (2013). The effects of the electroless copper coating to the thermal expansion behaviors of silicon carbide particles reinforced copper matrix composites for the electronic packaging applications. School of Materials Engineering.
Čikaški stil citiranja (17. izdanje)Azmi Kamardin. The Effects of the Electroless Copper Coating to the Thermal Expansion Behaviors of Silicon Carbide Particles Reinforced Copper Matrix Composites for the Electronic Packaging Applications. Perlis, Malaysia: School of Materials Engineering, 2013.
MLA način citiranja (8. izdanje)Azmi Kamardin. The Effects of the Electroless Copper Coating to the Thermal Expansion Behaviors of Silicon Carbide Particles Reinforced Copper Matrix Composites for the Electronic Packaging Applications. School of Materials Engineering, 2013.