APA引文

Ong, C. C. (2016). Structural characterisation and properties of lead-free solders on different surface roughness of copper substrate.

Chicago Style (17th ed.) Citation

Ong, Chien Chung. Structural Characterisation and Properties of Lead-free Solders on Different Surface Roughness of Copper Substrate. 2016.

MLA引文

Ong, Chien Chung. Structural Characterisation and Properties of Lead-free Solders on Different Surface Roughness of Copper Substrate. 2016.

警告：這些引文格式不一定是100％准確.