Raja Nurul Hamizah Raja Norazli. (2018). A study on thermal properties of flexible printed electronic circuit subjected to cyclic bending load.
Chicago Style (17th ed.) CitationRaja Nurul Hamizah Raja Norazli. A Study on Thermal Properties of Flexible Printed Electronic Circuit Subjected to Cyclic Bending Load. 2018.
MLA (8th ed.) CitationRaja Nurul Hamizah Raja Norazli. A Study on Thermal Properties of Flexible Printed Electronic Circuit Subjected to Cyclic Bending Load. 2018.
Warning: These citations may not always be 100% accurate.