A study on thermal properties of flexible printed electronic circuit subjected to cyclic bending load /
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| Main Author: | |
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| Format: | Book |
| Language: | English |
| Published: |
2018.
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| Subjects: | |
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| Physical Description: | xiii, 67 pages : some colour illustrations, charts, photographs ; 30 cm 1 computer disc (12 cm) |
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| Bibliography: | Reference : pages 62-63. |