Modeling and design of electromagnetic compatibility for high-speed printed circuit boards and packaging /
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| Main Author: | |
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| Format: | Book |
| Language: | English |
| Published: |
Boca Raton, FL. :
CRC Press,
2017.
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| Subjects: | |
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Perpustakaan Laman Hikmah Kampus Teknologi, UTeM: 8
| Call Number: |
TK7868.P7 .W44 2017 |
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| Copy Unknown | Available Place a Hold |