Kok, H. E. (2019). Characterization of adhesive layer of laminating pressed flexible printed circuit panel.
Čikaški stil citiranja (17. izdanje)Kok, Hoi Ern. Characterization of Adhesive Layer of Laminating Pressed Flexible Printed Circuit Panel. 2019.
MLA način citiranja (8. izdanje)Kok, Hoi Ern. Characterization of Adhesive Layer of Laminating Pressed Flexible Printed Circuit Panel. 2019.
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