Backside chipping improvement of non-backcoated bare die device for mobile application /
This project is backside chipping improvement of non- backcoated bare die device for mobile application due to low yield performance. Analysis of this project will be use JMP software to analyze the prediction result and final result in order to improve backside chipping. Based on data analysis, if...
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| Main Author: | |
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| Format: | Book |
| Language: | English |
| Published: |
2020.
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| Subjects: | |
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| Summary: | This project is backside chipping improvement of non- backcoated bare die device for mobile
application due to low yield performance. Analysis of this project will be use JMP software to
analyze the prediction result and final result in order to improve backside chipping. Based on
data analysis, if backside chipping increases, sidewall chipping will increases as well. In order
to reduce backside chipping, investigation had found three potential area that may improve
backside and sidewall chipping with parameter optimization. Two main element was identified
on this problem which are material and machine. Z2 blade type is identify as one of contribution
of this issue and machine parameter for chuck table feedspeed and cutting ratio are the other
variance that causing higher backside chipping. By using six sigma tools (DMAIC) this project
resulted improve yield performance with new type ofZ2 blade with optimize parameter of table
feedspeed and cutting depth ratio.
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| Physical Description: | ix, 42 pages : colour illustrations, charts, photographs ; 30 cm |
| Bibliography: | Reference : pages 39-41. |
| Access: | Confidential until 23 August 2025. |