APA (7th ed.) Citation

Lim, W. K. (2012). Mechanical properties of intermetallic compound in microchips with various bond pad metallizations.

Chicago Style (17th ed.) Citation

Lim, Weng Keat. Mechanical Properties of Intermetallic Compound in Microchips with Various Bond Pad Metallizations. 2012.

MLA (8th ed.) Citation

Lim, Weng Keat. Mechanical Properties of Intermetallic Compound in Microchips with Various Bond Pad Metallizations. 2012.

Warning: These citations may not always be 100% accurate.