Mechanical properties of intermetallic compound in microchips with various bond pad metallizations /
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| Main Author: | |
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| Format: | Software eBook |
| Language: | English |
| Published: |
2012.
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| Subjects: | |
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Perpustakaan Laman Hikmah Kampus Induk, UTeM: 1
| Call Number: |
TA483 .L55 2012 |
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| Copy Unknown | Available Place a Hold |