Advanced thermal management materials

Advanced thermal management materials

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Bibliographic Details
Main Author:	Jiang, Guosheng
Other Authors:	Diao, Liyong, Kuang, Ken
Format:	Book
Language:	English
Published:	New York Springer 2013
Subjects:	Heat sinks (Electronics) Microelectronic packaging > Materials > Thermal properties Microelectronics > Cooling
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