Chen, W. K. (2014). Effect of substrate surface condition on thermal cycling behaviour of lead-free solders.
芝加哥风格引文Chen, Wei Keat. Effect of Substrate Surface Condition on Thermal Cycling Behaviour of Lead-free Solders. 2014.
MLA引文Chen, Wei Keat. Effect of Substrate Surface Condition on Thermal Cycling Behaviour of Lead-free Solders. 2014.
警告：这些引文格式不一定是100％准确.