Chen, W. K. (2014). Effect of substrate surface condition on thermal cycling behaviour of lead-free solders.
Cita Chicago (17th ed.)Chen, Wei Keat. Effect of Substrate Surface Condition on Thermal Cycling Behaviour of Lead-free Solders. 2014.
Cita MLA (8th ed.)Chen, Wei Keat. Effect of Substrate Surface Condition on Thermal Cycling Behaviour of Lead-free Solders. 2014.
Atenció: Aquestes cites poden no estar 100% correctes.