Cita APA (7a ed.)

Chen, W. K. (2014). Effect of substrate surface condition on thermal cycling behaviour of lead-free solders.

Cita Chicago Style (17a ed.)

Chen, Wei Keat. Effect of Substrate Surface Condition on Thermal Cycling Behaviour of Lead-free Solders. 2014.

Cita MLA (8a ed.)

Chen, Wei Keat. Effect of Substrate Surface Condition on Thermal Cycling Behaviour of Lead-free Solders. 2014.