Chen, W. K. (2014). Effect of substrate surface condition on thermal cycling behaviour of lead-free solders.
Chicago-viite (17. p.)Chen, Wei Keat. Effect of Substrate Surface Condition on Thermal Cycling Behaviour of Lead-free Solders. 2014.
MLA-viite (8. p.)Chen, Wei Keat. Effect of Substrate Surface Condition on Thermal Cycling Behaviour of Lead-free Solders. 2014.
Varoitus: Nämä viitteet eivät aina ole täysin luotettavia.