Chen, W. K. (2014). Effect of substrate surface condition on thermal cycling behaviour of lead-free solders.
Style de citation Chicago (17e éd.)Chen, Wei Keat. Effect of Substrate Surface Condition on Thermal Cycling Behaviour of Lead-free Solders. 2014.
Style de citation MLA (8e éd.)Chen, Wei Keat. Effect of Substrate Surface Condition on Thermal Cycling Behaviour of Lead-free Solders. 2014.
Attention : ces citations peuvent ne pas être correctes à 100%.