Lua APA (7ú heag.)

Chen, W. K. (2014). Effect of substrate surface condition on thermal cycling behaviour of lead-free solders.

Lua i Stíl Chicago (17ú heag.)

Chen, Wei Keat. Effect of Substrate Surface Condition on Thermal Cycling Behaviour of Lead-free Solders. 2014.

Lua MLA (8ú heag.)

Chen, Wei Keat. Effect of Substrate Surface Condition on Thermal Cycling Behaviour of Lead-free Solders. 2014.

Rabhadh: Seans nach mbeach na luanna seo go hiomlán cruinn i ngach uile chás.