Chen, W. K. (2014). Effect of substrate surface condition on thermal cycling behaviour of lead-free solders.
शिकागो शैली (17वां संस्करण) प्रशस्ति पत्रChen, Wei Keat. Effect of Substrate Surface Condition on Thermal Cycling Behaviour of Lead-free Solders. 2014.
एमएलए (8वां संस्करण) प्रशस्ति पत्रChen, Wei Keat. Effect of Substrate Surface Condition on Thermal Cycling Behaviour of Lead-free Solders. 2014.
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