Chen, W. K. (2014). Effect of substrate surface condition on thermal cycling behaviour of lead-free solders.
Chicagoスタイル(17版)引用形式Chen, Wei Keat. Effect of Substrate Surface Condition on Thermal Cycling Behaviour of Lead-free Solders. 2014.
MLA(8版)引用形式Chen, Wei Keat. Effect of Substrate Surface Condition on Thermal Cycling Behaviour of Lead-free Solders. 2014.
警告: この引用は必ずしも正確ではありません.