APA (7e ed.) Bronvermelding

Chen, W. K. (2014). Effect of substrate surface condition on thermal cycling behaviour of lead-free solders.

Chicago (17e ed.) Bronvermelding

Chen, Wei Keat. Effect of Substrate Surface Condition on Thermal Cycling Behaviour of Lead-free Solders. 2014.

MLA (8e ed.) Bronvermelding

Chen, Wei Keat. Effect of Substrate Surface Condition on Thermal Cycling Behaviour of Lead-free Solders. 2014.

Let op: Deze citaties zijn niet altijd 100% accuraat.