APA引文

Chen, W. K. (2014). Effect of substrate surface condition on thermal cycling behaviour of lead-free solders.

Chicago Style (17th ed.) Citation

Chen, Wei Keat. Effect of Substrate Surface Condition on Thermal Cycling Behaviour of Lead-free Solders. 2014.

MLA引文

Chen, Wei Keat. Effect of Substrate Surface Condition on Thermal Cycling Behaviour of Lead-free Solders. 2014.

警告：這些引文格式不一定是100％准確.