Chen, W. K. (2014). Effect of substrate surface condition on thermal cycling behaviour of lead-free solders.
Chicago-referens (17:e uppl.)Chen, Wei Keat. Effect of Substrate Surface Condition on Thermal Cycling Behaviour of Lead-free Solders. 2014.
MLA-referens (8:e uppl.)Chen, Wei Keat. Effect of Substrate Surface Condition on Thermal Cycling Behaviour of Lead-free Solders. 2014.
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