Citazione APA

Chen, W. K. (2014). Effect of substrate surface condition on thermal cycling behaviour of lead-free solders.

Stile di citazione Chicago

Chen, Wei Keat. Effect of Substrate Surface Condition on Thermal Cycling Behaviour of Lead-free Solders. 2014.

Citazione MLA

Chen, Wei Keat. Effect of Substrate Surface Condition on Thermal Cycling Behaviour of Lead-free Solders. 2014.

Attenzione: Queste citazioni potrebbero non essere precise al 100%.