Effect of substrate surface condition on thermal cycling behaviour of lead-free solders /
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フォーマット: | ソフトウェア eBook |
言語: | English |
出版事項: |
2014.
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LEADER | 01650pam a2200421 i 4500 | ||
---|---|---|---|
001 | 92002 | ||
003 | UTeM | ||
005 | 20210206201314.0 | ||
007 | co ag |||||||| | ||
008 | 210206s2014 my ||||| |||| 00| | eng d | ||
020 | |c gift | ||
040 | |a UTeM |b eng |c UTeM |e rda | ||
090 | 0 | 0 | |a TA418.7 |b .C43 2014 |
100 | 1 | |a Chen, Wei Keat, |e author. |9 47734 | |
245 | 1 | 0 | |a Effect of substrate surface condition on thermal cycling behaviour of lead-free solders / |c Chen Wei Keat. |
264 | 1 | |c 2014. | |
300 | |a xiv, 89 pages : |b colour illustrations, charts ; |c 30 cm + |e 1 computer disc (12 cm) | ||
336 | |a text |2 rdacontent | ||
336 | |a still image |2 rdacontent | ||
337 | |a unmediated |2 rdamedia | ||
338 | |a volume |2 rdacarrier | ||
347 | |2 rda |a text file |b PDF | ||
500 | |a Accompanied by CD : CDR 10707. | ||
650 | 0 | |a Solder and soldering. |9 2083 | |
650 | 0 | |a Surfaces (Technology) |x Analysis. |9 2010 | |
650 | 0 | |a Metals |x Surfaces |x Testing. |9 47735 | |
710 | 2 | |a Universiti Teknikal Malaysia Melaka, |9 235 |e issuing body. | |
790 | |a Faculty of Manufacturing Engineering | ||
791 | |a Bachelor of Manufacturing Engineering (Engineering Materials) | ||
792 | |a 2014 | ||
942 | |2 lcc |c UGP - A |k a | ||
996 | |a BMFB | ||
997 | |a FKP | ||
998 | 0 | 0 | |a hrl/240615 |
998 | 0 | 0 | |a rh/040221 |
999 | |c 92002 |d 92002 | ||
952 | |0 0 |1 0 |2 lcc |4 0 |6 TA04187 C43 02014 |7 0 |9 117762 |a PLHKI |b PLHKI |c 1 |d 2019-02-26 |e UTEM |g 0.00 |l 1 |o TA418.7 .C43 2014 |p 0000114669 |r 2018-11-28 |s 2018-11-28 |w 2019-02-26 |y UGP - A | ||
952 | |0 0 |1 0 |2 lcc |4 0 |6 CDR10707 |7 0 |9 119938 |a MEDIA |b MEDIA |c 5 |d 2019-02-26 |g 0.00 |l 0 |o CDR 10707 |p 0000117319 |r 2016-02-02 |s 2016-02-02 |w 2019-02-26 |y CDR - MEA |