Effect of substrate surface condition on thermal cycling behaviour of lead-free solders /
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| Main Author: | |
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| Format: | Software eBook |
| Language: | English |
| Published: |
2014.
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| Subjects: | |
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| 100 | 1 | |a Chen, Wei Keat, |e author. |9 47734 | |
| 245 | 1 | 0 | |a Effect of substrate surface condition on thermal cycling behaviour of lead-free solders / |c Chen Wei Keat. |
| 264 | 1 | |c 2014. | |
| 300 | |a xiv, 89 pages : |b colour illustrations, charts ; |c 30 cm + |e 1 computer disc (12 cm) | ||
| 336 | |a text |2 rdacontent | ||
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| 347 | |2 rda |a text file |b PDF | ||
| 500 | |a Accompanied by CD : CDR 10707. | ||
| 650 | 0 | |a Solder and soldering. |9 2083 | |
| 650 | 0 | |a Surfaces (Technology) |x Analysis. |9 2010 | |
| 650 | 0 | |a Metals |x Surfaces |x Testing. |9 47735 | |
| 710 | 2 | |a Universiti Teknikal Malaysia Melaka, |9 235 |e issuing body. | |
| 790 | |a Faculty of Manufacturing Engineering | ||
| 791 | |a Bachelor of Manufacturing Engineering (Engineering Materials) | ||
| 792 | |a 2014 | ||
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